M38510/07903BEB vs 74S157N feature comparison

M38510/07903BEB NXP Semiconductors

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74S157N YAGEO Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SIGNETICS CORP PHILIPS COMPONENTS
Part Package Code DIP
Package Description DIP, DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family S S
JESD-30 Code R-XDIP-T16 R-PDIP-T16
Logic IC Type MULTIPLEXER MULTIPLEXER
Number of Functions 4 4
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 12 ns 15 ns
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 3 1
Load Capacitance (CL) 15 pF
Power Supply Current-Max (ICC) 78 mA

Compare M38510/07903BEB with alternatives

Compare 74S157N with alternatives