M38510/07301BCB
vs
M38510/07301BCA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SIGNETICS CORP
LANSDALE SEMICONDUCTOR INC
Package Description
DIP,
DIP, DIP14,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
S
S
JESD-30 Code
R-XDIP-T14
R-GDIP-T14
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
9 ns
5.5 ns
Qualification Status
Not Qualified
Qualified
Screening Level
MIL-M-38510 Class B
38535Q/M;38534H;883B
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
4
3
JESD-609 Code
e0
Length
19.56 mm
Max I(ol)
0.02 A
Package Equivalence Code
DIP14,.3
Peak Reflow Temperature (Cel)
NOT APPLICABLE
Power Supply Current-Max (ICC)
45 mA
Prop. Delay@Nom-Sup
9 ns
Schmitt Trigger
NO
Seated Height-Max
5.08 mm
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Time@Peak Reflow Temperature-Max (s)
NOT APPLICABLE
Width
7.62 mm
Compare M38510/07301BCB with alternatives
Compare M38510/07301BCA with alternatives