M38510/05704BCA
vs
MC14006BAL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP,
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Count Direction
RIGHT
Family
4000/14000/40000
JESD-30 Code
R-XDIP-T14
R-XDIP-T14
Logic IC Type
PARALLEL IN SERIAL OUT
Number of Bits
8
5
Number of Functions
1
1
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
UNSPECIFIED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
1465 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
Supply Voltage-Max (Vsup)
12.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP14,.3
Power Supplies
5/15 V
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
Compare M38510/05704BCA with alternatives