M38510/05554BEA
vs
CD4050BMJ/883
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
QP SEMICONDUCTOR INC
|
E2V TECHNOLOGIES PLC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
|
| JESD-30 Code |
R-GDIP-T16
|
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
BUFFER
|
|
| Number of Functions |
6
|
|
| Number of Inputs |
1
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
|
| Package Code |
DIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Propagation Delay (tpd) |
345 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-PRF-38535 Class B
|
|
| Supply Voltage-Max (Vsup) |
15 V
|
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
NO
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Position |
DUAL
|
|
| Base Number Matches |
5
|
3
|
|
|
|
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