M38510/00202BCB
vs
N7473A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Package Description
,
DIP, DIP14,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MASTER SLAVE OPERATION
Family
TTL/H/L
JESD-30 Code
R-GDIP-T14
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Polarity
COMPLEMENTARY
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
40 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
MASTER-SLAVE
fmax-Min
15 MHz
Base Number Matches
3
3
Max Frequency@Nom-Sup
15000000 Hz
Max I(ol)
0.016 A
Package Equivalence Code
DIP14,.3
Power Supply Current-Max (ICC)
40 mA
Terminal Pitch
2.54 mm
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