M38223M4D-XXXFP
vs
M38223M4DXXXFP
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
QFP,
|
Pin Count |
80
|
80
|
Reach Compliance Code |
unknown
|
compliant
|
Has ADC |
YES
|
YES
|
Additional Feature |
3 TO 5.5 @ 32KHZ IN LOW-SPEED MODE
|
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
R-PQFP-G80
|
|
Length |
20 mm
|
20 mm
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
|
|
Number of External Interrupts |
7
|
|
Number of I/O Lines |
54
|
54
|
Number of Serial I/Os |
1
|
|
Number of Terminals |
80
|
80
|
Number of Timers |
5
|
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
PWM Channels |
NO
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
QFP
|
QFP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
|
RAM (words) |
512
|
|
ROM (words) |
16000
|
|
ROM Programmability |
MROM
|
|
Seated Height-Max |
3.05 mm
|
|
Speed |
8 MHz
|
8 MHz
|
Supply Current-Max |
13 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4 V
|
4 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
1
|
HTS Code |
|
8542.31.00.01
|
|
|
|
Compare M38223M4D-XXXFP with alternatives
Compare M38223M4DXXXFP with alternatives