M37531M4-XXXGP
vs
M37542M2T-XXXGP
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
MITSUBISHI ELECTRIC CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LQFP, QFP32,.35SQ,32
|
LQFP,
|
| Pin Count |
32
|
32
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
ALSO OPERATES AT 2.2V MINIMUM SUPPLY
|
OPERATES AT 2.2V MIN SUPPLY
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
MELPS740
|
|
| Clock Frequency-Max |
8 MHz
|
8 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G32
|
| Length |
7 mm
|
7 mm
|
| Number of I/O Lines |
25
|
25
|
| Number of Terminals |
32
|
32
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| PWM Channels |
NO
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
LQFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
256
|
|
| ROM (words) |
8192
|
|
| ROM Programmability |
MROM
|
MROM
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
8 MHz
|
4 MHz
|
| Supply Current-Max |
8 mA
|
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
5 V
|
4 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
7 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare M37531M4-XXXGP with alternatives
Compare M37542M2T-XXXGP with alternatives