M36W832TE70ZA6S vs RD28F1604C3TD70 feature comparison

M36W832TE70ZA6S STMicroelectronics

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RD28F1604C3TD70 Intel Corporation

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS INTEL CORP
Part Package Code BGA BGA
Package Description 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 LFBGA, BGA66,8X12,32
Pin Count 66 66
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 70 ns
Additional Feature SRAM IS ORGANISED AS 512K X 16 SRAM IS ORGANIZED AS 256K X 16
JESD-30 Code R-PBGA-B66 R-PBGA-B66
JESD-609 Code e0 e0
Length 12 mm 10 mm
Memory Density 33554432 bit 16777216 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 2097152 words 1048576 words
Number of Words Code 2000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 2MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA66,8X12,32 BGA66,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Standby Current-Max 0.00002 A 0.000005 A
Supply Current-Max 0.02 mA 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL EXTENDED
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 1

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