M36W216TI85ZA1T
vs
AT52BR1674-85CI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
ATMEL CORP
Part Package Code
BGA
BGA
Package Description
LFBGA,
TFBGA, BGA66,8X12,32
Pin Count
66
66
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Additional Feature
STATIC RAM ORGANISED AS 128KBIT X 16
ALSO CONTAINS 256K X 16 SRAM
JESD-30 Code
R-PBGA-B66
R-PBGA-B66
Length
12 mm
10 mm
Memory Density
16777216 bit
16777216 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX16
1MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.4 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.3 V
3.3 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Access Time-Max
85 ns
JESD-609 Code
e0
Mixed Memory Type
FLASH+SRAM
Package Equivalence Code
BGA66,8X12,32
Supply Current-Max
0.045 mA
Terminal Finish
TIN LEAD
Compare M36W216TI85ZA1T with alternatives
Compare AT52BR1674-85CI with alternatives