M36W216TI70ZA1
vs
RD38F1020C0ZTL0
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
LFBGA, BGA66,8X12,32
|
| Pin Count |
66
|
66
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
STATIC RAM ORGANISED AS 128KBIT X 16
|
SRAM IS ORGANIZED AS 512K X 16
|
| JESD-30 Code |
R-PBGA-B66
|
R-PBGA-B66
|
| Length |
12 mm
|
10 mm
|
| Memory Density |
16777216 bit
|
33554432 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
66
|
66
|
| Number of Words |
1048576 words
|
2097152 words
|
| Number of Words Code |
1000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Organization |
1MX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.4 mm
|
| Supply Voltage-Max (Vsup) |
3.3 V
|
3.3 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL EXTENDED
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
1
|
| Access Time-Max |
|
70 ns
|
| Mixed Memory Type |
|
FLASH+SRAM
|
| Package Equivalence Code |
|
BGA66,8X12,32
|
| Standby Current-Max |
|
0.000006 A
|
| Supply Current-Max |
|
0.05 mA
|
|
|
|
Compare M36W216TI70ZA1 with alternatives
Compare RD38F1020C0ZTL0 with alternatives