M36W0T7040T0ZAQ
vs
M36W0T7040T0ZAQF
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
NUMONYX
|
Part Package Code |
BGA
|
BGA
|
Package Description |
8 X 10 MM, 0.80 MM PITCH, TFBGA-88
|
TFBGA,
|
Pin Count |
88
|
88
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
70 ns
|
|
Additional Feature |
PSRAM IS ORGANIZED AS 1M X 16
|
PSRAM IS ORGANIZED AS 1M X 16
|
JESD-30 Code |
R-PBGA-B88
|
R-PBGA-B88
|
JESD-609 Code |
e0
|
e1
|
Length |
10 mm
|
10 mm
|
Memory Density |
134217728 bit
|
134217728 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Mixed Memory Type |
FLASH+PSRAM
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
88
|
88
|
Number of Words |
8388608 words
|
8388608 words
|
Number of Words Code |
8000000
|
8000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Organization |
8MX16
|
8MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA88,8X12,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
2 V
|
2 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
4
|
1
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare M36W0T7040T0ZAQ with alternatives
Compare M36W0T7040T0ZAQF with alternatives