M36P0R9070E0ZACF vs M36P0R9070E0ZAC feature comparison

M36P0R9070E0ZACF Micron Technology Inc

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M36P0R9070E0ZAC STMicroelectronics

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description TFBGA, BGA107,9X12,32 8 X 11 MM, 0.80 MM PITCH, TFBGA-107
Pin Count 107 107
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 96 ns 70 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 8M X 16 PSRAM IS ORGANISED AS 8M X 16BIT
JESD-30 Code R-PBGA-B107 R-PBGA-B107
JESD-609 Code e1 e0
Length 11 mm 11 mm
Memory Density 536870912 bit 536870912 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 107 107
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 32MX16 32MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA107,9X12,32 BGA107,9X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.0002 A
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER COMMERCIAL EXTENDED
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 3

Compare M36P0R9070E0ZACF with alternatives

Compare M36P0R9070E0ZAC with alternatives