M36LLR8760M1ZAQF
vs
RD38F2030W0YTQ2
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NUMONYX
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
TFBGA, BGA88,8X12,32
|
| Pin Count |
88
|
88
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
|
CONTAINS 16 MBIT PSRAM, ALSO CONTAINS 64 MBIT FLASH
|
| JESD-30 Code |
R-PBGA-B88
|
R-PBGA-B88
|
| JESD-609 Code |
e1
|
e0
|
| Length |
10 mm
|
10 mm
|
| Memory Density |
268435456 bit
|
67108864 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
88
|
88
|
| Number of Words |
16777216 words
|
4194304 words
|
| Number of Words Code |
16000000
|
4000000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-25 °C
|
-25 °C
|
| Organization |
16MX16
|
4MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Access Time-Max |
|
70 ns
|
| Mixed Memory Type |
|
FLASH+PSRAM+SRAM
|
| Package Equivalence Code |
|
BGA88,8X12,32
|
| Standby Current-Max |
|
0.0001 A
|
| Supply Current-Max |
|
0.055 mA
|
|
|
|
Compare M36LLR8760M1ZAQF with alternatives
Compare RD38F2030W0YTQ2 with alternatives