M36L0R7060T1ZAQF vs RD38F2030W0YTQ2 feature comparison

M36L0R7060T1ZAQF Micron Technology Inc

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RD38F2030W0YTQ2 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC INTEL CORP
Part Package Code BGA BGA
Package Description TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 85 ns 70 ns
Additional Feature PSRAM IS ORGANIZED AS 4M X 16 CONTAINS 16 MBIT PSRAM, ALSO CONTAINS 64 MBIT FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e0
Length 10 mm 10 mm
Memory Density 134217728 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM+SRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA88,8X12,32 BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 3 3
Standby Current-Max 0.0001 A
Supply Current-Max 0.055 mA

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