M368L3313ETM-CB0
vs
V826632K24SATG-D3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
PROMOS TECHNOLOGIES INC
Part Package Code
DIMM
DIMM
Package Description
DIMM, DIMM184
DIMM-184
Pin Count
184
184
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
SINGLE BANK PAGE BURST
Access Time-Max
0.75 ns
0.65 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
133 MHz
200 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-N184
R-XDMA-N184
JESD-609 Code
e0
e4
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR DRAM MODULE
DDR DRAM MODULE
Memory Width
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
184
184
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX64
32MX64
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM184
DIMM184
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
8192
Self Refresh
YES
Supply Current-Max
2.32 mA
3.2 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.5 V
Supply Voltage-Nom (Vsup)
2.5 V
2.6 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
2
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
2.6 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare M368L3313ETM-CB0 with alternatives
Compare V826632K24SATG-D3 with alternatives