M368L0914BT0-LA0
vs
M368L0914DT2-CB3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
DIMM
DIMM
Package Description
DIMM, DIMM184
DIMM, DIMM184
Pin Count
184
184
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.8 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
100 MHz
133 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-XDMA-N184
R-XDMA-N184
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR DRAM MODULE
DDR DRAM MODULE
Memory Width
64
64
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
184
184
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
8MX64
8MX64
Output Characteristics
3-STATE
3-STATE
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Equivalence Code
DIMM184
DIMM184
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Standby Current-Max
0.012 A
Supply Current-Max
1.38 mA
Compare M368L0914BT0-LA0 with alternatives
Compare M368L0914DT2-CB3 with alternatives