M30LW128D110ZA6F
vs
M30LW128D110ZA1T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
NUMONYX
Part Package Code
BGA
BGA
Package Description
10 X 13 MM, 1 MM PITCH, LEAD FREE, TBGA-64
10 X 13 MM, 1 MM PITCH, TBGA-64
Pin Count
64
64
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
110 ns
110 ns
Alternate Memory Width
8
8
Command User Interface
YES
Common Flash Interface
YES
Data Polling
NO
JESD-30 Code
R-PBGA-B64
R-PBGA-B64
Length
13 mm
13 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
128
Number of Terminals
64
64
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
8MX16
8MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA64,8X8,40
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Page Size
4/8 words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3.3 V
3.3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
128K
Standby Current-Max
0.00008 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Width
10 mm
10 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Compare M30LW128D110ZA6F with alternatives
Compare M30LW128D110ZA1T with alternatives