M30626FHPGP
vs
M30622SPGP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
MITSUBISHI ELECTRIC CORP
Part Package Code
QFP
QFP
Package Description
LFQFP, QFP100,.63SQ,20
LFQFP, QFP100,.63SQ,20
Pin Count
100
100
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Additional Feature
ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10 MHZ
OPERATES AT 2.7V MINIMUM SUPPLY @ 10 MHZ
Address Bus Width
20
20
Bit Size
16
16
CPU Family
M16C
M16C
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
16
8
JESD-30 Code
S-PQFP-G100
S-PQFP-G100
JESD-609 Code
e2
e0
Length
14 mm
14 mm
Moisture Sensitivity Level
3
Number of I/O Lines
88
113
Number of Terminals
100
100
On Chip Program ROM Width
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-20 °C
-20 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
LFQFP
Package Equivalence Code
QFP100,.63SQ,20
QFP100,.63SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
31744
4096
ROM (words)
393216
ROM Programmability
FLASH
Seated Height-Max
1.7 mm
1.7 mm
Speed
24 MHz
24 MHz
Supply Current-Max
27 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
5 V
3 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Copper (Sn/Cu)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
14 mm
14 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
15
1
Compare M30626FHPGP with alternatives
Compare M30622SPGP with alternatives