M2L64S40DWG-7L
vs
K4S64163LH-BF750
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
TFBGA, BGA54,9X9,32
|
VFBGA,
|
| Pin Count |
54
|
54
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Mode |
FOUR BANK PAGE BURST
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
8 ns
|
5.4 ns
|
| Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
| Clock Frequency-Max (fCLK) |
105 MHz
|
|
| I/O Type |
COMMON
|
|
| Interleaved Burst Length |
1,2,4,8
|
|
| JESD-30 Code |
R-PBGA-B54
|
S-PBGA-B54
|
| JESD-609 Code |
e0
|
|
| Length |
9 mm
|
8 mm
|
| Memory Density |
67108864 bit
|
67108864 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
54
|
54
|
| Number of Words |
4194304 words
|
4194304 words
|
| Number of Words Code |
4000000
|
4000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-25 °C
|
| Organization |
4MX16
|
4MX16
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA54,9X9,32
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
4096
|
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Self Refresh |
YES
|
YES
|
| Sequential Burst Length |
1,2,4,8,FP
|
|
| Standby Current-Max |
0.0005 A
|
|
| Supply Current-Max |
0.1 mA
|
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
8 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare M2L64S40DWG-7L with alternatives
Compare K4S64163LH-BF750 with alternatives