M2GL150TS-1FCG1152I
vs
M2GL150TS-1FC1152I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA, BGA1152,34X34,40
|
35 X 35 MM, 1 MM PITCH, FBGA-1152
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Microsemi Corporation
|
|
JESD-30 Code |
S-PBGA-B1152
|
S-PBGA-B1152
|
Length |
35 mm
|
35 mm
|
Moisture Sensitivity Level |
4
|
|
Number of Inputs |
574
|
574
|
Number of Logic Cells |
146124
|
146124
|
Number of Outputs |
574
|
574
|
Number of Terminals |
1152
|
1152
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1152,34X34,40
|
BGA1152,34X34,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.9 mm
|
2.9 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
35 mm
|
35 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
10 Weeks
|
Packing Method |
|
TRAY
|
Peak Reflow Temperature (Cel) |
|
240
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|