M2GL090TS-1FGG676I
vs
M2GL090TS-1FG676I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
27 X 27 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-676
|
BGA, BGA676,26X26,40
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Factory Lead Time |
10 Weeks
|
|
| JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B676
|
| Length |
27 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Inputs |
425
|
425
|
| Number of Logic Cells |
86316
|
86316
|
| Number of Outputs |
425
|
425
|
| Number of Terminals |
676
|
676
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA676,26X26,40
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.44 mm
|
2.44 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
27 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
|
|
|