M2GL090T-1FG484M
vs
M2GL090-FGG484
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
23 X 23 MM, 1 MM PITCH, FBGA-484
|
23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
52 Weeks, 5 Days
|
10 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B484
|
JESD-609 Code |
e0
|
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Inputs |
267
|
267
|
Number of Outputs |
267
|
267
|
Number of Terminals |
484
|
484
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA484,22X22,40
|
BGA484,22X22,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
250
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.44 mm
|
2.44 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
MILITARY
|
OTHER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Width |
23 mm
|
23 mm
|
Base Number Matches |
3
|
2
|
Number of Logic Cells |
|
86316
|
Packing Method |
|
TRAY
|
|
|
|
Compare M2GL090T-1FG484M with alternatives
Compare M2GL090-FGG484 with alternatives