M2GL090-FG484IX417
vs
M2GL090TS-1FCSG325I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
23 X 23 MM, 1 MM PITCH, FBGA-484
|
, BGA325,21X21,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B484
|
S-PBGA-B325
|
| JESD-609 Code |
e0
|
|
| Length |
23 mm
|
|
| Number of Terminals |
484
|
325
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
2.44 mm
|
|
| Supply Voltage-Max |
1.26 V
|
|
| Supply Voltage-Min |
1.14 V
|
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
23 mm
|
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Microsemi Corporation
|
| Moisture Sensitivity Level |
|
3
|
| Number of Inputs |
|
180
|
| Number of Logic Cells |
|
86316
|
| Number of Outputs |
|
180
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
BGA325,21X21,20
|
| Qualification Status |
|
Not Qualified
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
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