M2GL060TS-VF400I
vs
M2GL060TS-VFG400I
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
17 X 17 MM, 0.80 MM PITCH, VFBGA-400
|
17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
10 Weeks
|
JESD-30 Code |
S-PBGA-B400
|
S-PBGA-B400
|
Length |
17 mm
|
17 mm
|
Number of Inputs |
207
|
207
|
Number of Outputs |
207
|
207
|
Number of Terminals |
400
|
400
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Packing Method |
TRAY
|
TRAY
|
Peak Reflow Temperature (Cel) |
240
|
260
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.51 mm
|
1.51 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
20
|
30
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
3
|
|
|
|