M2GL060-1FCSG325I
vs
M2GL060-1FCS325I
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
11 X 11 MM, 0.50 MM PITCH, ROHS COMPLIANT, FBGA-325
|
BGA,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
10 Weeks
|
|
JESD-30 Code |
S-PBGA-B325
|
S-PBGA-B325
|
Length |
11 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of Inputs |
200
|
|
Number of Outputs |
200
|
|
Number of Terminals |
325
|
325
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA325,21X21,20
|
BGA325,21X21,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
20
|
Width |
11 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|