M2GL050T-1FCS325I
vs
M2GL050T-1FCSG325I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
11 X 11 MM, 0.50 MM PITCH, FBGA-325
BGA, BGA325,21X21,20
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
14 Weeks
JESD-30 Code
S-PBGA-B325
S-PBGA-B325
Length
11 mm
Number of Inputs
200
200
Number of Logic Cells
56340
56340
Number of Outputs
200
200
Number of Terminals
325
325
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA325,21X21,20
BGA325,21X21,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Peak Reflow Temperature (Cel)
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.01 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
11 mm
Base Number Matches
1
1
Moisture Sensitivity Level
3