M2GL025T-1FCS325
vs
M2GL025T-1FCS325I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA, BGA325,21X21,20
11 X 11 MM, 0.50 MM PITCH, FBGA-325
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
S-PBGA-B325
S-PBGA-B325
Number of Inputs
180
180
Number of Logic Cells
27696
27696
Number of Outputs
180
180
Number of Terminals
325
325
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA325,21X21,20
BGA325,21X21,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
240
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
20
Base Number Matches
2
2
Factory Lead Time
10 Weeks
Length
11 mm
Packing Method
TRAY
Seated Height-Max
1.01 mm
Terminal Pitch
0.5 mm
Width
11 mm
Compare M2GL025T-1FCS325 with alternatives
Compare M2GL025T-1FCS325I with alternatives