M2GL010T-VF400I
vs
M2GL010T-VFG400I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
17 X 17 MM, 0.80 MM PITCH, VFBGA-400
17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
8 Weeks
JESD-30 Code
S-PBGA-B400
S-PBGA-B400
Length
17 mm
17 mm
Number of Inputs
195
195
Number of Logic Cells
12084
12084
Number of Outputs
195
195
Number of Terminals
400
400
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA400,20X20,32
BGA400,20X20,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Packing Method
TRAY
TRAY
Peak Reflow Temperature (Cel)
240
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.51 mm
1.51 mm
Supply Voltage-Max
1.26 V
1.26 V
Supply Voltage-Min
1.14 V
1.14 V
Supply Voltage-Nom
1.2 V
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
17 mm
Base Number Matches
1
1
Samacsys Manufacturer
Microchip
Moisture Sensitivity Level
3