M2GL005-VF256I
vs
M2GL005-VFG256I
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
14 X 14 MM, 0.80 MM PITCH, VFBGA-256
|
14 X 14 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.31.00.01
|
Factory Lead Time |
8 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
Microchip
|
Microchip
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
JESD-609 Code |
e0
|
|
Length |
14 mm
|
14 mm
|
Number of Inputs |
161
|
161
|
Number of Outputs |
161
|
161
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
100 °C
|
100 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFBGA
|
LFBGA
|
Package Equivalence Code |
BGA256,16X16,32
|
BGA256,16X16,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Packing Method |
TRAY
|
TRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.56 mm
|
1.56 mm
|
Supply Voltage-Max |
1.26 V
|
1.26 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
14 mm
|
14 mm
|
Base Number Matches |
2
|
2
|
ECCN Code |
|
3A991.D
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|