M29W800FT70ZA3E
vs
MBM29DL800TA-70PBT-SF2
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
BGA
Package Description
TFBGA, BGA48,6X8,32
Pin Count
48
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
TOP
TOP
Command User Interface
YES
YES
Common Flash Interface
YES
Data Polling
YES
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e3
Length
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
Moisture Sensitivity Level
1
Number of Functions
1
Number of Sectors/Size
1,2,1,15
2,4,2,14
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
FBGA
Package Equivalence Code
BGA48,6X8,32
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
YES
Seated Height-Max
1.2 mm
Sector Size
16K,8K,32K,64K
16K,8K,32K,64K
Standby Current-Max
0.0001 A
0.000005 A
Supply Current-Max
0.02 mA
0.045 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
Base Number Matches
3
4
Power Supplies
3.3 V
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