M29W800FB7AZA6SE
vs
MX26LV800BXEC-70
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MACRONIX INTERNATIONAL CO LTD
Part Package Code
BGA
BGA
Package Description
TFBGA,
LFBGA, BGA48,6X8,32
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Seated Height-Max
1.2 mm
1.3 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
1
Command User Interface
YES
Data Polling
YES
Endurance
2000 Write/Erase Cycles
JESD-609 Code
e0
Number of Sectors/Size
1,2,1,15
Package Equivalence Code
BGA48,6X8,32
Qualification Status
Not Qualified
Ready/Busy
YES
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Terminal Finish
TIN LEAD
Toggle Bit
YES
Compare M29W800FB7AZA6SE with alternatives
Compare MX26LV800BXEC-70 with alternatives