M29W640GT60ZA3F
vs
EN29LV400B-55RBC
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
EON SILICON SOLUTION INC
|
Package Description |
,
|
TFBGA, BGA48,6X8,32
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Boot Block |
TOP
|
BOTTOM
|
Memory IC Type |
FLASH
|
FLASH
|
Programming Voltage |
3 V
|
3.3 V
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
2
|
2
|
Access Time-Max |
|
55 ns
|
Alternate Memory Width |
|
8
|
Command User Interface |
|
YES
|
Data Polling |
|
YES
|
Endurance |
|
100000 Write/Erase Cycles
|
JESD-30 Code |
|
R-PBGA-B48
|
JESD-609 Code |
|
e0
|
Length |
|
8 mm
|
Memory Density |
|
4194304 bit
|
Memory Width |
|
16
|
Number of Functions |
|
1
|
Number of Sectors/Size |
|
1,2,1,7
|
Number of Terminals |
|
48
|
Number of Words |
|
262144 words
|
Number of Words Code |
|
256000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
|
256KX16
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
TFBGA
|
Package Equivalence Code |
|
BGA48,6X8,32
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Parallel/Serial |
|
PARALLEL
|
Qualification Status |
|
Not Qualified
|
Ready/Busy |
|
YES
|
Seated Height-Max |
|
1.1 mm
|
Sector Size |
|
16K,8K,32K,64K
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.03 mA
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
3.3 V
|
Surface Mount |
|
YES
|
Technology |
|
CMOS
|
Temperature Grade |
|
COMMERCIAL
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
|
BALL
|
Terminal Pitch |
|
0.8 mm
|
Terminal Position |
|
BOTTOM
|
Toggle Bit |
|
YES
|
Width |
|
6 mm
|
|
|
|
Compare M29W640GT60ZA3F with alternatives
Compare EN29LV400B-55RBC with alternatives