M29W640GL90ZA3E vs S29GL064N90BFI32 feature comparison

M29W640GL90ZA3E Micron Technology Inc

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S29GL064N90BFI32 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Package Description , 8.15 X 6.15 MM, LEAD FREE, FBGA-48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Memory IC Type FLASH FLASH
Programming Voltage 3 V 3 V
Type NOR TYPE
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 48
Access Time-Max 90 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B48
JESD-609 Code e1
Length 8.15 mm
Memory Density 67108864 bit
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 48
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 6.15 mm

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Compare S29GL064N90BFI32 with alternatives