M29W640GL90NB3F vs AM29LV640GL98REE feature comparison

M29W640GL90NB3F Micron Technology Inc

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AM29LV640GL98REE Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Package Description , MO-142, TSOP-56
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Memory IC Type FLASH FLASH
Programming Voltage 3 V 3 V
Type NOR TYPE NOR TYPE
Base Number Matches 2 2
Part Package Code TSOP1
Pin Count 56
Access Time-Max 90 ns
Alternate Memory Width 8
Boot Block BOTTOM/TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-30 Code R-PDSO-G56
JESD-609 Code e0
Length 18.4 mm
Memory Density 67108864 bit
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 128
Number of Terminals 56
Number of Words 4194304 words
Number of Words Code 4000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 4MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.026 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Toggle Bit YES
Width 14 mm

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