M29W640GL60ZA3F vs AM29LV400BB55RWAI feature comparison

M29W640GL60ZA3F Micron Technology Inc

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AM29LV400BB55RWAI Spansion

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Package Description , TFBGA, BGA48,6X8,32
Reach Compliance Code compliant not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Memory IC Type FLASH FLASH
Programming Voltage 3 V 3 V
Type NOR TYPE NOR TYPE
Base Number Matches 2 2
Part Package Code BGA
Pin Count 48
Access Time-Max 55 ns
Additional Feature BOTTOM BOOT BLOCK
Alternate Memory Width 8
Boot Block BOTTOM
Command User Interface YES
Data Polling YES
Endurance 1000000 Write/Erase Cycles
JESD-30 Code R-PBGA-B48
JESD-609 Code e0
Length 8.15 mm
Memory Density 4194304 bit
Memory Width 16
Moisture Sensitivity Level 3
Number of Functions 1
Number of Sectors/Size 1,2,1,7
Number of Terminals 48
Number of Words 262144 words
Number of Words Code 256000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 256KX16
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA48,6X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1.2 mm
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Toggle Bit YES
Width 6.15 mm

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Compare AM29LV400BB55RWAI with alternatives