M29W640GB70ZA3E vs TE28F640B3BC70 feature comparison

M29W640GB70ZA3E Numonyx Memory Solutions

Buy Now Datasheet

TE28F640B3BC70 Intel Corporation

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NUMONYX INTEL CORP
Part Package Code BGA TSOP
Package Description TFBGA, 12 X 20 MM, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PDSO-G48
Length 8 mm 18.4 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL GULL WING
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM DUAL
Width 6 mm 12 mm
Base Number Matches 2 2
Rohs Code No
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE

Compare M29W640GB70ZA3E with alternatives

Compare TE28F640B3BC70 with alternatives