M29W640DB90ZA1
vs
NAND01GW4B3AZA6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
7 X 11 MM, 0.80 MM PITCH, TFBGA-63
TFBGA, BGA63,10X12,32
Pin Count
63
63
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
35 ns
Additional Feature
BOTTOM BOOT BLOCK
Alternate Memory Width
8
Boot Block
BOTTOM
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
Length
11 mm
12 mm
Memory Density
67108864 bit
1073741824 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
4194304 words
67108864 words
Number of Words Code
4000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
4MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.05 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Type
NOR TYPE
Width
7 mm
9.5 mm
Base Number Matches
2
2
Rohs Code
Command User Interface
YES
Data Polling
NO
JESD-609 Code
e0
Number of Sectors/Size
1K
Package Equivalence Code
BGA63,10X12,32
Page Size
1K words
Ready/Busy
YES
Sector Size
64K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Terminal Finish
TIN LEAD
Toggle Bit
NO
Compare M29W640DB90ZA1 with alternatives
Compare NAND01GW4B3AZA6 with alternatives