M29W400FB5AZA3SF vs MBM29LV400BC-55PW-E1 feature comparison

M29W400FB5AZA3SF Micron Technology Inc

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MBM29LV400BC-55PW-E1 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, PLASTIC, SCSP-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Additional Feature BOTTOM BOOT BLOCK MINIMUM 100000 PROGRAM/ERASE CYCLES
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 4.67 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C -20 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 6 mm 3.52 mm
Base Number Matches 1 1
JESD-609 Code e3
Qualification Status Not Qualified
Terminal Finish TIN

Compare M29W400FB5AZA3SF with alternatives

Compare MBM29LV400BC-55PW-E1 with alternatives