M29W400FB55ZA3SF vs S29AL004D55BANR22 feature comparison

M29W400FB55ZA3SF Micron Technology Inc

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S29AL004D55BANR22 Cypress Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC CYPRESS SEMICONDUCTOR CORP
Part Package Code BGA
Package Description TFBGA, VFBGA,
Pin Count 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 55 ns 55 ns
Additional Feature BOTTOM BOOT BLOCK ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 8.15 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 1 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 6 mm 6.15 mm
Base Number Matches 1 2
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish TIN LEAD

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