M29W400DT70ZA1T
vs
AM29SL400CT-110WAI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
STMICROELECTRONICS
SPANSION INC
Part Package Code
BGA
BGA
Package Description
6 X 9 MM, 0.80 MM PITCH, TFBGA-48
TFBGA,
Pin Count
48
48
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
70 ns
110 ns
Additional Feature
TOP BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
TOP
Command User Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
JESD-609 Code
e0
e0
Length
9 mm
8.15 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Sectors/Size
1,2,1,7
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
1.8 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
2.2 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
Width
6 mm
6.15 mm
Base Number Matches
1
2
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
240
Time@Peak Reflow Temperature-Max (s)
30
Compare M29W400DT70ZA1T with alternatives
Compare AM29SL400CT-110WAI with alternatives