M29W400DB70ZA6
vs
MBM29LV400TC-55PW
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NUMONYX
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
BGA
BGA
Package Description
6 X 9 MM, 0.80 MM PITCH, TFBGA-48
PLASTIC, SCSP-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
55 ns
Additional Feature
BOTTOM BOOT BLOCK
MINIMUM 100000 PROGRAM/ERASE CYCLES
Alternate Memory Width
8
8
Boot Block
BOTTOM
TOP
Command User Interface
YES
Data Polling
YES
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
9 mm
4.67 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Sectors/Size
1,2,1,7
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
256KX16
256KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Equivalence Code
BGA48,6X8,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1 mm
Sector Size
16K,8K,32K,64K
Standby Current-Max
0.0001 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Toggle Bit
YES
Type
NOR TYPE
NOR TYPE
Width
6 mm
3.52 mm
Base Number Matches
4
1
Compare M29W400DB70ZA6 with alternatives
Compare MBM29LV400TC-55PW with alternatives