M29W320DB90ZA1T
vs
M29DW323DB90ZA1F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NUMONYX
STMICROELECTRONICS
Part Package Code
BGA
BGA
Package Description
7 X 11 MM, 0.80 MM PITCH, TFBGA-63
7 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-63
Pin Count
63
63
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
90 ns
90 ns
Additional Feature
BOTTOM BOOT BLOCK
BOTTOM BOOT BLOCK
Alternate Memory Width
8
8
Boot Block
BOTTOM
BOTTOM
JESD-30 Code
R-PBGA-B63
R-PBGA-B63
JESD-609 Code
e0
e1
Length
11 mm
11 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
63
63
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Type
NOR TYPE
NOR TYPE
Width
7 mm
7 mm
Base Number Matches
2
2
Rohs Code
Compare M29W320DB90ZA1T with alternatives
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