M29W160ET70N6T vs AM29LV160MT-70WCK feature comparison

M29W160ET70N6T Micron Technology Inc

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AM29LV160MT-70WCK Spansion

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SPANSION INC
Package Description 12 X 20 MM, TSOP-48 TFBGA,
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block TOP TOP
JESD-30 Code R-PDSO-G48 R-PBGA-B48
Length 18.4 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position DUAL BOTTOM
Type NOR TYPE NOR TYPE
Width 12 mm 8 mm
Base Number Matches 1 1
Part Package Code BGA
Pin Count 48
JESD-609 Code e1
Moisture Sensitivity Level 3
Qualification Status Not Qualified
Terminal Finish TIN SILVER COPPER

Compare M29W160ET70N6T with alternatives

Compare AM29LV160MT-70WCK with alternatives