M29W160EB70ZS3E vs AM29LV160MB-70PCF feature comparison

M29W160EB70ZS3E Numonyx Memory Solutions

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AM29LV160MB-70PCF Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NUMONYX SPANSION INC
Part Package Code BGA BGA
Package Description 11 X 13 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-64 LBGA,
Pin Count 64 64
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM
JESD-30 Code R-PBGA-B64 R-PBGA-B64
Length 13 mm 13 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 11 mm 11 mm
Base Number Matches 2 1
Rohs Code Yes
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare M29W160EB70ZS3E with alternatives

Compare AM29LV160MB-70PCF with alternatives