M29W160DB70N1F vs M29W160EB70N3T feature comparison

M29W160DB70N1F STMicroelectronics

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M29W160EB70N3T Numonyx Memory Solutions

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS NUMONYX
Part Package Code TSOP TSOP
Package Description 12 X 20 MM, PLASTIC, TSOP-48 12 X 20 MM, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6
Length 18.4 mm 18.4 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -40 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL AUTOMOTIVE
Terminal Finish TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 2

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