M29W017D90ZA1 vs AM29LV160BB90WEE feature comparison

M29W017D90ZA1 STMicroelectronics

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AM29LV160BB90WEE Spansion

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SPANSION INC
Part Package Code BGA
Package Description 0.80 MM PITCH, TFBGA-48 BGA,
Pin Count 48
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 90 ns 90 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form BALL BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE NOR TYPE
Width 8 mm
Base Number Matches 2 2
Rohs Code No
Additional Feature MIN 1000K WRITE CYCLES; 20 YEAR DATA RETENTION; CAN BE CONFG AS 1M X 16; BOTTOM BOOT BLOCK
Boot Block BOTTOM
Data Retention Time-Min 20
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

Compare M29W017D90ZA1 with alternatives

Compare AM29LV160BB90WEE with alternatives