M29F800DT55N1E vs M29F800FT55N3S2 feature comparison

M29F800DT55N1E Numonyx Memory Solutions

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M29F800FT55N3S2 Micron Technology Inc

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer NUMONYX MICRON TECHNOLOGY INC
Part Package Code TSOP
Package Description 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 ,
Pin Count 48
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 55 ns
Additional Feature TOP BOOT BLOCK
Alternate Memory Width 8
Boot Block TOP
JESD-30 Code R-PDSO-G48
JESD-609 Code e3/e6
Length 18.4 mm
Memory Density 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN/TIN BISMUTH
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Type NOR TYPE
Width 12 mm
Base Number Matches 2 2

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