M29F800DB70N3F vs M29F800DB70N1F feature comparison

M29F800DB70N3F STMicroelectronics

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M29F800DB70N1F Numonyx Memory Solutions

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS NUMONYX
Part Package Code TSOP TSOP
Package Description 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Additional Feature BOTTOM BOOT BLOCK BOTTOM BOOT BLOCK
Alternate Memory Width 8 8
Boot Block BOTTOM BOTTOM
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3/e6 e3/e6
Length 18.4 mm 18.4 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260 260
Programming Voltage 5 V 5 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish TIN/TIN BISMUTH TIN/TIN BISMUTH
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Type NOR TYPE NOR TYPE
Width 12 mm 12 mm
Base Number Matches 2 2

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