M29F400FT5AN6S2
vs
MX29F400TTC55G
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MACRONIX INTERNATIONAL CO LTD
|
| Package Description |
,
|
12 X 20 MM, PLASTIC, TSOP1-48
|
| Reach Compliance Code |
unknown
|
unknown
|
| Memory IC Type |
FLASH
|
FLASH
|
| Programming Voltage |
5 V
|
5 V
|
| Base Number Matches |
2
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSOP1
|
| Pin Count |
|
48
|
| Access Time-Max |
|
55 ns
|
| Additional Feature |
|
100,000 MINIMUM ERASE/PROGRAM CYCLES
|
| Alternate Memory Width |
|
8
|
| JESD-30 Code |
|
R-PDSO-G48
|
| JESD-609 Code |
|
e6
|
| Length |
|
18.4 mm
|
| Memory Density |
|
4194304 bit
|
| Memory Width |
|
16
|
| Moisture Sensitivity Level |
|
3
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
48
|
| Number of Words |
|
262144 words
|
| Number of Words Code |
|
256000
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
256KX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP1
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Parallel/Serial |
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN BISMUTH
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
12 mm
|
|
|
|
Compare M29F400FT5AN6S2 with alternatives
Compare MX29F400TTC55G with alternatives