M29F400FT55N6F2 vs MX29F400TTC55G feature comparison

M29F400FT55N6F2 Micron Technology Inc

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MX29F400TTC55G Macronix International Co Ltd

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MACRONIX INTERNATIONAL CO LTD
Package Description TSOP1, 12 X 20 MM, PLASTIC, TSOP1-48
Reach Compliance Code unknown unknown
Access Time-Max 55 ns 55 ns
Additional Feature TOP BOOT BLOCK 100,000 MINIMUM ERASE/PROGRAM CYCLES
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 256KX16 256KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 5 V 5 V
Screening Level AEC-Q100
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 2 1
Rohs Code Yes
Part Package Code TSOP1
Pin Count 48
JESD-609 Code e6
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Terminal Finish TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) 40

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